Article ID Journal Published Year Pages File Type
547720 Microelectronics Reliability 2006 5 Pages PDF
Abstract

Using hydrofluoric acid (HF) as catalyst, nanoporous SiO2 thin film was synthesized by sol–gel method. By scanning electron microscopy, Fourier transform infrared spectra, thermo gravimetric and differential thermal analysis, ellipsometry, capacitance–voltage and current–voltage measurements, the effects of annealing on film properties were discussed in detail. The introduction of HF results in the less polarizability, the preferable microstructures and the improved thermal stability of the nanoporous silica films. After thermal annealing at 450 °C, the crack-free films with strong hydrophobicity, ultra-low dielectric constant of 1.65, porosity of 78%, and leakage current density of 1.3 × 10−8 A cm−2 were obtained.

Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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