Article ID Journal Published Year Pages File Type
548035 Microelectronics Journal 2006 4 Pages PDF
Abstract

Ex situ electron-beam lithography followed by conventional wet etching has been used to pattern small holes 60–150 nm wide, ∼13 nm deep in GaAs substrates. These holes act as preferential nucleation sites for InAs dot growth during subsequent overgrowth. By varying either the InAs deposition amount or the thickness of a GaAs buffer layer, the occupancy over the patterned sites can be controlled. Comparison with growth on a planar substrate shows that preferential nucleation occurs due to a reduction in the apparent critical thickness above the pattern site; the magnitude of this reduction is dependent on the dimensions of the initial pattern.

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Physical Sciences and Engineering Computer Science Hardware and Architecture
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