Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
548035 | Microelectronics Journal | 2006 | 4 Pages |
Abstract
Ex situ electron-beam lithography followed by conventional wet etching has been used to pattern small holes 60–150 nm wide, ∼13 nm deep in GaAs substrates. These holes act as preferential nucleation sites for InAs dot growth during subsequent overgrowth. By varying either the InAs deposition amount or the thickness of a GaAs buffer layer, the occupancy over the patterned sites can be controlled. Comparison with growth on a planar substrate shows that preferential nucleation occurs due to a reduction in the apparent critical thickness above the pattern site; the magnitude of this reduction is dependent on the dimensions of the initial pattern.
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Authors
P. Atkinson, S.P. Bremner, D. Anderson, G.A.C. Jones, D.A. Ritchie,