| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 548127 | Microelectronics Reliability | 2016 | 7 Pages |
•Thermal–electric–mechanical coupled loads for COG in service were built.•The resistance of COG was studied under the coupled loads.•Fatigue life of COG decreased with the increased temperature and loading amplitude.•The life prediction of COG assembly under different temperatures was built.
It is well-known that chip-on-glass (COG) assembly is often subjected to the coupled effects of temperature, electrical current and cyclic mechanical loading in service. Therefore, the fatigue life and electrical property of COG assembly undergoing thermal–electric–mechanical coupled loads have been studied in the present work. Based on the present investigations, it was found that that the relative resistance of COG assembly in the fatigue process displayed different trends according to environmental temperature and mechanical loading amplitude. Moreover, the fatigue life of the COG assembly decreased with the increased temperature and the increased loading amplitude. Finally, the Basquin's equation can predict the fatigue life of COG assembly at different environmental temperatures well.
