Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
548270 | Microelectronics Reliability | 2011 | 6 Pages |
Abstract
This paper reports a methodology to correlate Hot Carrier Injection (HCI) degradation mechanism and electrical figures of merit on Lateral-Diffused Metal–Oxide-Semiconductor (LDMOS) transistor. This method is based on RF life test in radar operating conditions coupled to a high drain voltage in order to make visible HCI degradation. We propose drain current modeling vs. time based on a simple extraction procedure. The electron density trapped in the oxide is extracted from hot carrier induced series resistance enhancement model (HISREM – i.e. ΔRd model). From this methodology, the degradation of RF-LDMOS due to HCI is quantified and could be simulated with EDA.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
L. Lachéze, O. Latry, P. Dherbécourt, K. Mourgues, V. Purohit, H. Maanane, J.P. Sipma, F. Cornu, P. Eudeline,