Article ID Journal Published Year Pages File Type
548280 Microelectronics Reliability 2011 5 Pages PDF
Abstract

This paper concerns the problem of generating reduced dynamic thermal models whose elements have physical interpretation. The compact models of an electronic system are generated here based on the analysis of the time constant spectra of system transient thermal responses. The proposed method is illustrated on a practical example of an integrated power amplifier with a heat sink. The experiments demonstrate the influence of contact resistance and cooling conditions on the resulting values of thermal model elements.

Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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