Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
548280 | Microelectronics Reliability | 2011 | 5 Pages |
Abstract
This paper concerns the problem of generating reduced dynamic thermal models whose elements have physical interpretation. The compact models of an electronic system are generated here based on the analysis of the time constant spectra of system transient thermal responses. The proposed method is illustrated on a practical example of an integrated power amplifier with a heat sink. The experiments demonstrate the influence of contact resistance and cooling conditions on the resulting values of thermal model elements.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Marcin Janicki, Jedrzej Banaszczyk, Bjorn Vermeersch, Gilbert De Mey, Andrzej Napieralski,