| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 548286 | Microelectronics Reliability | 2011 | 5 Pages |
The shear fatigue lives of Anisotropic Conductive Adhesive Film (ACF) joints were evaluated experimentally and theoretically under different testing conditions. The shear fatigue tests of ACF joints were performed with different loading amplitudes. It is found that the fatigue lives of ACF joints decrease with increasing loading amplitudes and Basquin’s equation is fit to predict the fatigue lives of ACF joints. Hygrothermal aging and thermal cycling tests were conducted to investigate the shear strength and lives of ACF joints. The results show that the shear strength and lives of ACF joints decrease with increasing hygrothermal aging time, however increase firstly and then decrease with increasing thermal cycling time. The fatigue life model considering aging damage is proposed and the predictions of the fatigue life agree with the experimental results at different aging time for ACF joints.
