Article ID Journal Published Year Pages File Type
548579 Microelectronics Reliability 2006 5 Pages PDF
Abstract

Contradicting ideas about implementing temperature-dependent Young’s modulus in a time-independent quasi-static thermomechanical analysis can be found regularly in the literature. The incremental (quasi-static evolution) and the non-incremental (Hookean) solution schemes represent simplifications of the viscoelastic behavior of polymeric materials according to different theoretical disciplines. These two schemes lead to completely different solutions when Young’s modulus is a function of the temperature. In this paper we review the ideas about implementing temperature-dependent Young’s modulus in a time-independent quasi-static thermomechanical analysis. Differences of the ideologies are highlighted using bimaterial beam solutions. Thermomechanical deformations of a bimaterial structure, which resembles a plastic ball grid array package assembly, at different temperatures are measured using shadow Moiré interferometry. Numerical solutions from different schemes are compared with measurement results.

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Physical Sciences and Engineering Computer Science Hardware and Architecture
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