| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 548583 | Microelectronics Reliability | 2006 | 9 Pages |
Abstract
The reliability of the eutectic Sn37Pb (63%Sn37%Pb) and Sn3.5Ag (96.5%Sn3.5%Ag) solder bumps with an under bump metallization (UBM) consisting of an electroless Ni(P) plus a thin layer of Au was evaluated following isothermal aging at 150 °C. All the solder bumps remained intact after 1500 h aging at 150 °C. Solder bump microstructure evolution and interface structure change during isothermal aging were observed and correlated with the solder bump shear strength and failure modes. Cohesive solder failure was the only failure mode for the eutectic Sn37Pb solder bump, while partial cohesive solder failure and partial Ni(P) UBM/Al metallization interfacial delamination was the main failure mode for eutectic Sn3.5Ag solder bump.
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Computer Science
Hardware and Architecture
Authors
W.-M. Chen, P. McCloskey, S.C. O’Mathuna,