| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 549011 | Microelectronics Reliability | 2014 | 7 Pages |
•Adhesion and reliability against humidity improvement for silicon/underfill/polyimide structure for flexible electronics.•UV/Ozone treatment and sol–gel derived hybrid layers were used as enhancement methods.•Adhesion was enhanced for more than 300%.•Reliability against humidity was improved for more than 1000%.
Adhesion and mechanical reliability improvement is an important issue for flexible electronics due to weak bonds between silicon/underfill/polyimide interfaces. These interfaces are bonded with weak hydrogen and ester bonds which are vulnerable to humidity. Therefore, in this study, adhesion and reliability of silicon/underfill/polyimide interfaces are enhanced by using UV/Ozone treatment and sol–gel derived hybrid layers. In order to examine the effectiveness of those surface treatment methods, double cantilever beam (DCB) test and subcritical crack growth test were applied to accurately measure the adhesion energy and subcritical crack growth rate. The results showed that the adhesion and reliability against humidity were enhanced by more than 300% and 1000% when both surface treatment methods were applied. Also, the adhesive failure path was altered to mixed mode failure of both cohesive and adhesive failure paths.
