| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 549020 | Microelectronics Reliability | 2013 | 4 Pages |
Abstract
•A physic-based approach for life-time estimation in power cycling tests is presented.•The presented approach is supported by numerical simulations.•The simulation data is updated in each crack propagation step.
For the calculation of the lifetime of power modules only empirical lifetime models are available. These models represent a best-fit of a large number of results from power cycling tests, and are not derived from a physical model. In this paper a physic-based approach will be presented. Crack propagation in a solder layer, the increase of the thermal resistance and therewith the expected lifetime is calculated.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
P. Steinhorst, T. Poller, J. Lutz,