Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
549051 | Microelectronics Reliability | 2013 | 4 Pages |
•The cause of the turn-around effect under the NBTI stress is investigated.•Interface states and positive oxide charges are created by a high NBTI stress.•Negative oxide charges are created by a low NBTI stress.•A low stress voltage induces the turn-around effect that degrades the device.
The effect of a low stress voltage on the negative bias temperature instability degradation in a nanoscale p-channel metal–oxide–semiconductor field-effect transistor using high-k/metal gate stacks is investigated. The direct current–current voltage and carrier separation methods are used to separate the effects of electrons and holes. The results indicate that a high stress voltage generates positive oxide charges that degrade the device, but a low stress voltage generates negative oxide charges that induce the turn-around effect of the threshold voltage.