Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
549060 | Microelectronics Reliability | 2013 | 4 Pages |
Abstract
•A new approach for recording EBIC embedded in a Dual Beam system is presented.•The technique was applied to drive TEM preparation in FA studies of a leaky junction.•Possibility of 3D EBIC tomography of P-N junction is showed.
After its golden age during the decades of the development of Silicon IC technology, nowadays Electron Beam Induced Current (EBIC) technique comes back to importance mostly on photonic and high speed electron devices based on compound semiconductors. A new approach for recording a fast EBIC embedded in a Dual Beam system is presented.The combined use of multi-slicing FIB, SEM and EBIC enables 3D tomography of P–N junctions and drives TEM preparation in failure analysis studies of leaky junctions.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
M. Vanzi, S. Podda, E. Musu, R. Cao,