| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 549146 | Microelectronics Reliability | 2013 | 7 Pages |
Abstract
⺠The AuSn20 solder is prepared by laminate rolling-annealing method. ⺠Eutectic microstructure and (Ni, Au)3Sn2 phase form in reflowed AuSn20/Ni joint. ⺠Formation of (Ni, Au)3Sn2 consumes the potential δ-phase in solder matrix. ⺠The shear strength of single lap joints decreases as aging at 150 or 200 °C. ⺠Coarsen microstructure has notable effect on the reduction of shear strength.
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Authors
Xiao-feng Wei, Yu-kun Zhang, Ri-chu Wang, Yan Feng,