| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 549205 | Microelectronics Reliability | 2012 | 8 Pages |
Abstract
⺠Strengths of LED die are tested by point-load test (PLT) and line-load test (LLT). ⺠Mechanism has been discussed and validated via these test results and analyses. ⺠Die strengths on chip surface failure are 1.48 GPa for PLT and 1.2 GPa for LLT. ⺠Die strengths on sapphire surface failure are 1.36 GPa for PLT and 0.64 GPa for LLT. ⺠Two tests have been found feasible, easy-to-use and reliable for LED die strength.
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Authors
C.H. Chen, M.Y. Tsai,