A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products

Currently, the portable electronic products trend to high speed, light weight, miniaturization and multifunctionality. In that field, solder joint reliability in term of both drop impact and thermal cycling loading conditions is a great concern for portable electronic products. The transition to lead-free solder happened to coincide with a dramatic increase in portable electronic products. Sn–Ag–Cu (SAC) is now recognized as the standard lead free solder alloy for packaging interconnects in the electronics industry. The present study reviews the reliability of different Ag-content SAC solder joints in term of both thermal cycling and drop impact from the viewpoints of bulk alloy microstructure and tensile properties. The finding of the study indicates that the best SAC composition for drop impact performance is not necessarily the best composition for optimum thermal cycling reliability. The level of Ag-content in SAC solder alloy can be an advantage or a disadvantage depending on the application, package and reliability requirements. As a result, most component assemblers are using at least two (and in many cases even more) lead-free solder sphere alloys to meet various package requirements.

► We discuss the drop impact and thermal cycling reliability of Sn–xAg–Cu bulk solders. ► The low Ag content gives rise to more primary Sn phase. ► The high fraction of primary Sn phase increases the drop impact reliability. ► The high Ag content gives rise to more Ag3Sn and single crystal-like microstructures. ► The Ag3Sn and single crystal microstructures increase the thermal cycling reliability.