| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 549283 | Microelectronics Reliability | 2012 | 5 Pages |
Abstract
In this paper, a physical model is proposed to estimate the TRIAC solder joint fatigue during power cycling. The lifetime prediction is based on the following assumptions: the case temperature swing (ΔTcase) is the main acceleration factor, the solder joints are the weakest materials in the non-insulated TO-220AB TRIAC package and the plastic strain within the solder layer due to shearing is the failure cause.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
S. Jacques, A. Caldeira, N. Batut, A. Schellmanns, R. Leroy, L. Gonthier,