Investigation of the fluid/structure interaction phenomenon in IC packaging

In the present study, experiment and simulation studies were conducted on the fluid/structure interaction (FSI) analysis of integrated circuit (IC) packaging. The visualisation of FSI phenomenon in the actual package is difficult due to limitations of package size, available equipment, and the high cost of the experimental setup. However, the experimental data are necessary to validate the simulation results in the FSI analysis of IC packaging. Scaled-up package size was fabricated to emulate the encapsulation of IC packaging and to study the effects of FSI phenomenon in the moulded package. The interaction between the fluid and the structure was observed. The deformation of the imitated chip was studied experimentally. The air-trap mechanism that occurred during the experiment is also presented in this paper. Simulation technique was utilised to validate the experimental result and to describe the physics of FSI. The predicted flow front was validated well by the experiment. Hence, the virtual modelling technique was proven to be excellent in handling this problem. The study also extends FSI modelling in actual-size packaging.