| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 549307 | Microelectronics Reliability | 2011 | 4 Pages |
Abstract
The goal of conducted investigations was to study microstructure and surface morphology of copper thin films deposited during standard (with argon) and self-sustained (without argon presence) magnetron sputtering deposition processes. Different types of magnetron source powering were used: direct current (DC), medium frequency (MF), pulsed-DC. The investigated copper films were deposited by means of balanced magnetron sputtering source on Si (1 1 1) substrates. The results of investigations showed that the average size of the copper crystallites of all samples were equal to dozens of nanometre. However, the self-sustained sputtering deposition processes, in comparison to the standard ones, resulted in smoother film surface.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
A. Wiatrowski, W.M. Posadowski, G. Jóźwiak, J. Serafińczuk, R. Szeloch, T. Gotszalk,