| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 549485 | Microelectronics Reliability | 2010 | 7 Pages |
Abstract
This article deals with the reliability of WL-CSP subjected to a four-point bend-test according to the JEDEC standard and the repeatability of this test. The evaluation of the test repeatability shows a 5% variation on the characteristic Weibull parameter η. Two dedicated failure detection methods are used: with an event detector and with data acquisition and no difference are observed. Parameters considered are pre-load magnitude and loading frequency. PCB strain due to pre-load is measured and its effect on the product reliability is evaluated. Based on these measurements a pre-load value is defined. It is also shown that a frequency of 3 Hz modifies the studied package lifetime.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Cédric Le Coq, Adellah Tougui, Marie-Pascale Stempin, Laurent Barreau,