| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 549527 | Microelectronics Reliability | 2010 | 7 Pages |
Abstract
A semi-empirical model is derived to predict the board level drop-impact lifetime of HVQFN-packages soldered on a printed circuit board. The strain that evolves in the soldered interconnections is evaluated by a finite element model and related to the experimentally determined lifetime. The result is a power law and it is compared to literature data. In addition, a measure for the strain on the board is obtained analytically and compared with the experimental data. Here, too, dependence in the form of a power law is found. The combination of both results strongly suggests a near-linear relationship between the strain in the solder and the strain in the board.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
J. de Vries, W. Balemans, W.D. van Driel,