Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
549566 | Microelectronics Reliability | 2009 | 7 Pages |
Abstract
Using circuit simulation extended by a proper failure criterion, the HBM and TLP robustness of high-voltage clamps can be accurately predicted without the need for test silicon. Electrical measurements, physical damage analysis, and device simulation have proved that the drain junction breakdown voltage constitutes the proper failure criterion for our HV active clamps.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Guido Notermans, Olivier Quittard, Anco Heringa, Željko Mrčarica, Fabrice Blanc, Hans van Zwol, Theo Smedes, Thomas Keller, Peter de Jong,