Article ID Journal Published Year Pages File Type
549566 Microelectronics Reliability 2009 7 Pages PDF
Abstract

Using circuit simulation extended by a proper failure criterion, the HBM and TLP robustness of high-voltage clamps can be accurately predicted without the need for test silicon. Electrical measurements, physical damage analysis, and device simulation have proved that the drain junction breakdown voltage constitutes the proper failure criterion for our HV active clamps.

Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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