Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
549753 | Microelectronics Reliability | 2007 | 9 Pages |
Abstract
In this paper the response spectra analysis is introduced to obtain transient structural responses of an undamped multiple degrees of freedom structural system subjected to an impact acceleration pulse of a half-sine waveform. The JEDEC drop test condition B is specifically chosen to investigate transient structural responses of a board-level test vehicle comprised of a test board and a mounted package during the drop impact process. Comparisons are made between computed and measured longitudinal strains on the test board as well as time integration and response spectra solutions for stresses in the solder joint.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai,