| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 549787 | Microelectronics Reliability | 2006 | 9 Pages |
Abstract
Small transient power clamps that include inverters may oscillate and disengage during an HBM ESD event. A transient power clamp created in a 0.25 μm process revealed an interesting solution to the problem. Adding a resistance to the final inverter may improve ESD performance.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Bradford L. Hunter, Brian K. Butka,