Thermal resistance modeling in FDSOI transistors with industry standard model BSIM-IMG

The channel in Fully Depleted Silicon On Insulator (FDSOI) transistors is completely isolated from the substrate via buried oxide (BOX) and from the sides by shallow trench isolations, which results in high thermal resistance (Rth). Further, Rth increases with reduction in channel length (Lg). In this paper, we have proposed a compact model for the geometry and temperature dependence of Rth in FDSOI transistors. The model is validated against experimental and Technology Computer Aided Design (TCAD) data. We also validate the radio-frequency (RF) model with measured high frequency data. The proposed model is implemented in the independent multigate model (BSIM-IMG) for FDSOI transistors.