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Growth nature of in-situ Cu6Sn5-phase and their influence on creep and damping characteristics of Sn-Cu material under high-temperature and humidity

Article ID Journal Published Year Pages File Type
6945473 Microelectronics Reliability 2018 8 Pages PDF
Keywords
Intermetallic compoundMicrostructureDamping capacityCreep performance
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
Preview
Growth nature of in-situ Cu6Sn5-phase and their influence on creep and damping characteristics of Sn-Cu material under high-temperature and humidity
Authors
Asit Kumar Gain, Liangchi Zhang,
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Microelectronics Reliability
Journal: Microelectronics Reliability
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