Article ID Journal Published Year Pages File Type
6945477 Microelectronics Reliability 2018 7 Pages PDF
Abstract
In this paper we present NBTI stress and recovery effects measured on PFET devices issued from various FDSOI technologies. NBTI degradation and recovery subsequent to DC stress are measured at the μs time scale. After in-depth analysis of temperature and stress/recovery bias effects, we propose new NBTI models for degradation and recovery kinetics including temperature, Vgstress and Vgrecovery dependencies. These models are finally validated on different technologies and various experimental conditions.
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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