Article ID Journal Published Year Pages File Type
6945487 Microelectronics Reliability 2018 12 Pages PDF
Abstract
This paper shows that the connection of MOR-based boundary condition independent (BCI) dynamic compact thermal models (DCTMs) and detailed models of heat transfer problems is not straightforward and is subject to numerical issues. In order to overcome this drawback, a novel definition of MOR-based BCI DCTMs is provided, which makes this connection feasible. As a result, the proposed BCI DCTMs can be connected without limitations to any detailed model of heat transfer problems and/or to any other MOR-based BCI DCTM.
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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