| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6945539 | Microelectronics Reliability | 2018 | 9 Pages |
Abstract
The key originality of the work is that it provides a comprehensive overview of the journey from design assessment an optimisation, through the manufacturing process and on to reliability testing. Areas of novelty in this work are associated with the development of fast, accurate surrogate models able to predict key reliability factors in response to a range of design parameters and insight into the development of a 3D manufacturing system for electronics packaging.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Tim Tilford, Stoyan Stoyanov, Jessica Braun, Jan Christoph Janhsen, Matthias Burgard, Richard Birch, Chris Bailey,