| Article ID | Journal | Published Year | Pages | File Type | 
|---|---|---|---|---|
| 6945670 | Microelectronics Reliability | 2018 | 8 Pages | 
Abstract
												First principles calculations of the SiC/Ti and SiC/Cr interfaces have been conducted based on the density functional theory, and adhesion properties along with the electronic structure were obtained. The crystallographic orientation dependence of the adhesion at the SiC/Ti and SiC/Cr interfaces has been investigated. The work of separation strongly depends on the crystallographic orientation with the SiC(112¯0)/Cr(001) interface having the highest value of Wsepâ¯=â¯4.71â¯J/m2. By analyzing the electronic structures, it was found that the charge transfer between C and Cr is larger, leading to stronger chemical bonds.
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											Authors
												Lei Li, Weichao Jin, Huisheng Yang, Kewei Gao, Pengwen Guo, Xiaolu Pang, Alex A. Volinsky, 
											