Article ID Journal Published Year Pages File Type
6945670 Microelectronics Reliability 2018 8 Pages PDF
Abstract
First principles calculations of the SiC/Ti and SiC/Cr interfaces have been conducted based on the density functional theory, and adhesion properties along with the electronic structure were obtained. The crystallographic orientation dependence of the adhesion at the SiC/Ti and SiC/Cr interfaces has been investigated. The work of separation strongly depends on the crystallographic orientation with the SiC(112¯0)/Cr(001) interface having the highest value of Wsep = 4.71 J/m2. By analyzing the electronic structures, it was found that the charge transfer between C and Cr is larger, leading to stronger chemical bonds.
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Physical Sciences and Engineering Computer Science Hardware and Architecture
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