| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6945926 | Microelectronics Reliability | 2018 | 6 Pages |
Abstract
The results indicate that different EFO current settings cause either complete or partial Pd coverage on FABs, which directly affects the Pd distribution at the bonded ball interface. The wire pull and ball shear tests show the bond strength decrease under three EFO current settings after HTST. This confirms that although Pd can serve as a protective layer for the bonded ball against attack from halides from within the epoxy molding compound (EMC), incomplete Pd coating and formation of the alloy may actually aggravate the corrosion on bonded ball.
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Authors
Pi-Ying Cheng, Po-Ying Lai, Jiun-Ming Ye, Tsung-Chia Chen, Cheng-Li Hsieh,