Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
6946105 | Microelectronics Reliability | 2017 | 6 Pages |
Abstract
As an approach to increasing their reliability, we doped Ag solder bumps with Pd and Au alloys to enhance their creep resistance, which we characterized using a nanoindentation technique. The hardnesses of the pure Ag and the Ag solders doped with Pd:3%, Pd:5%, and Pd:2%-Au:3% were 0.6 ± 0.1, 1.8 ± 0.2, 2.8 ± 0.3, and 3.1 ± 0.5 GPa, respectively. Although the hardness of the Ag solder was enhanced significantly when it contained Pd:2%-Au:3%, it exhibited a lower creep exponent (n > 2). The mechanism of the thermal recovery of the sample appears to be associated with activation of dislocation sources-also the reason for the decrease in hardness. The compounds doped with Pd:2%-Au:3% displayed significantly greater bond strengths and creep exponents, whereas the Pd-only compounds exhibited poorer reliability.
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Authors
Hua-Chiang Wen, Wu-Ching Chou, Shiuan Huei Lin, Don Son Jiang,