| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6946213 | Microelectronics Reliability | 2017 | 5 Pages |
Abstract
Glass transition temperature (Tg) is a key epoxy property and often being monitored in the production by the differential scanning calorimeter (DSC) method in the printed circuit board (PCB) industry. The dual-effect of cooling rate and annealing on the endothermic peak in the DSC scan of CE-688 epoxy resin plays a big role in the DSC Tg evaluation. An improved DSC program was developed in order to minimize/eliminate the influence of endothermic peak. Meanwhile, the curing pressure also shows distinct effect on the Tg of the epoxy resin.
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Authors
Qi Tao, Gerald Pinter, Thomas Krivec,