| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6946351 | Microelectronics Reliability | 2016 | 9 Pages |
Abstract
These techniques are deployed to study the response of 300μm diameter Aluminum and Aluminum coated Copper bonding wires to DC and AC currents. The experimental results are interpreted and verified by comparing them to numerical results obtained from finite element analysis. This study experimentally measures and reports, for the first time, the second and fourth in-plane and the second out-of-plane bending mode shapes of bonding wire.
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Authors
R. Saritas, M. Khater, S. Park, T. Dagdelen, E. Abdel-Rahman, M. Yavuz,