Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
6946365 | Microelectronics Reliability | 2016 | 7 Pages |
Abstract
Active thermal control for power modules can potentially extend the lifetime of the converter. This paper investigates the trade-off between the lifetime extension or de-rating and its cost due to the efficiency reduction. A short review on the existing approaches using control to reduce thermal stress of power modules is presented. Based on a given junction temperature profile, a method to evaluate the active thermal control's trade-off is presented. The concept is validated on a laboratory setup, where active thermal control is implemented by adapting the switching frequency. A discussion of the possible lifetime extension at the efficiency's expense is finally given.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Markus Andresen, Giampaolo Buticchi, Marco Liserre,