Article ID Journal Published Year Pages File Type
6946854 Microelectronics Reliability 2014 7 Pages PDF
Abstract
In hybrid electrical vehicles (HEV) and electric vehicles (EV) power semiconductors, packaged in a module, are used. Packaging technologies are suffering several wear out mechanisms, that are typically induced by thermal or power cycling. The type of wear out mechanism is affected by the connection technology but also by the load type. In the design of the inverter the mission profile simulation of the power module is an important step to ensure operation of the power module over the complete vehicle lifetime. Influences of application parameters are presented. Physics of failure based FEM simulation can help to develop appropriate lifetime models which are basis for the mission profile simulation. Available power module technology achieves the lifetime requirement for hybrid electric vehicles/electric vehicles, if the described method is applied in the design phase of the inverter.
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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