| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6946864 | Microelectronics Reliability | 2014 | 5 Pages |
Abstract
This work will focus on how to obtain experimental data of two different molding compounds (MC) in several stages of lifetime as well as implementing the results in a FE simulation model.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
S. Huber, M.v. Dijk, H. Walter, O. Wittler, T. Thomas, K.-D. Lang,