Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
6946866 | Microelectronics Reliability | 2014 | 5 Pages |
Abstract
In this study, different PCB materials were evaluated. Temperature dependent thermal conductivity of each material was measured and temperature-dependent partial discharge tests have been conducted.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
R. Randoll, W. Wondrak, A. Schletz,