| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6946895 | Microelectronics Reliability | 2014 | 5 Pages |
Abstract
As a main conclusion of these investigations, we found that electrolytes can easily penetrate thermoplastic overmold materials which are typically used by module manufacturers. This can lead to either reversible electrical failures which can be eliminated by drying or irreversible electrical failures because of material migration. The effective failure mode depends on mechanical and climate conditions inside the module which could not be simulated up to now under laboratory but only under application conditions.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
H. Preu, J. Feilmeier, M. Lang, N. Soellner, J. Walter, W. Mack,