| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6946896 | Microelectronics Reliability | 2014 | 6 Pages |
Abstract
This paper investigates the effect of void percentage in the solder layer on the shear strength and thermal property of DA3547 packages by SAC soldering technology. X-ray observation and shear tests revealed that the increase of solder paste volume significantly decreases the void percentage in the solder layer and thus improved the shear strength of the packages. Furthermore, packages with lower void percentage showed a lower junction temperature based on the results of IR test and finite element simulation. The temperature difference due to the effect void percentage shows a correlation with the input power. For the DA3547 packages studied in this research, voids show limited influence on the junction temperature under 50Â mA, the typical current recommended by Cree.
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Authors
Yang Liu, Stanley Y.Y. Leung, Jia Zhao, Cell K.Y. Wong, Cadmus A. Yuan, Guoqi Zhang, Fenglian Sun, Liangliang Luo,