| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6946922 | Microelectronics Reliability | 2012 | 8 Pages |
Abstract
Using TCAD tools, many reliability issues can be studied quantitatively. Examples are hot carrier degradation of interfaces, threshold voltage shifts during NBTI stress, radiation effects and soft errors, ESD and latch-up, thermo-mechanical issues, electro-migration and stress-voiding.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
P. Pfäffli, P. Tikhomirov, X. Xu, I. Avci, Y.-S. Oh, P. Balasingam, S. Krishnamoorthy, T. Ma,