| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6946945 | Microelectronics Reliability | 2012 | 6 Pages |
Abstract
Because of material movements intermetallic compound layers are formed between metal layers and solder joints. These intermetallics affect the reliability of the solder joints by reducing their lifetime during drop test or by accelerating the migration induced void formation. This study investigates the migration kinetics of Cu, Ni, Au and Sn in SAC305 solder joints on three different metal layers: Cu, NiAu and NiP. The aim of this study is the identification and description of migration processes during aging of solder joints with one and double sided Ni diffusion barriers.
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Authors
L. Meinshausen, H. Frémont, K. Weide-Zaage,