Article ID Journal Published Year Pages File Type
6946991 Microelectronics Reliability 2012 4 Pages PDF
Abstract
Enhanced degradation of n-MOSFETs with high-k/metal gate stacks under CHC/GIDL alternating stress is investigated. CHC stress generates negative oxide charges while GIDL stress generates positive oxide charges in the gate oxide near drain region. Theses oxide charges degrade device reliability, and degradation is enhanced when CHC stress and GIDL stress are applied alternatively. The degradation under CHC/GIDL alternating stress is due to the neutral traps and interface traps, and increases with the increase in frequency.
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Physical Sciences and Engineering Computer Science Hardware and Architecture
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