Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
6947085 | Microelectronics Reliability | 2012 | 4 Pages |
Abstract
The EBIC mode of SEM was used to image individual dislocations and measure the effect of local stress on EBIC contrast of threading dislocations (TDs) in GaN LEDs. In this method, EBIC shows that localized residual stress increases the recombination strength, γ, of TDs, which increases non-radiative recombination and leakage current in GaN LEDs.
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Authors
T. Nshanian, P.N. Grillot, M. Holub, S. Watanabe, W. Götz,