| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6947092 | Microelectronics Reliability | 2012 | 4 Pages |
Abstract
⺠A morphological gap (vacuum) in a defective via explains the IC malfunctioning. ⺠FIB/TEM analysis and micro-probing led to the detection of the vacuum. ⺠Failure analysts should check for a vacuum when no other failure cause is found.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Marco Sanna, Matteo Medda,