| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6947236 | Microelectronics Reliability | 2012 | 5 Pages |
Abstract
⺠We study the stiction induced by outgassing during the glass frit bonding process. ⺠The effect of the induced stiction is identified and quantified by comparing the width of the “pull-in windows”. ⺠Surface analysis indicates that the increasing stiction is due to the increased amount of C and Pb at the contact area.
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Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
F.Z. Ling, J. De Coster, A. Witvrouw, J. Celis, I. De Wolf,