Article ID Journal Published Year Pages File Type
6947306 Microelectronics Reliability 2011 5 Pages PDF
Abstract
An accurate estimation of the Blech length, the critical line length below which interconnect lines are immortal, is vital as it allows EDA tools to reduce their workload. In lines longer than the Blech length, either a void will inevitably nucleate and grow until the line fails, or the line will rupture. The majority of failure analyses reveal voiding as the failure mechanism however recent analysis suggest Blech length failures are characterised by simultaneous [6] voiding and rupture, and a non-zero steady-state drift velocity. This paper provides an alternative interpretation of results.
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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