| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6947368 | Microelectronics Reliability | 2011 | 5 Pages |
Abstract
In this paper, a method of thermal impedance spectroscopy for power modules is presented. This method enables a high resolution non-destructive analysis of the power module by means of electrical measurement and subsequent mathematical evaluation. The result provides a separation of partial thermal resistances corresponding material layers and facilitates a plausible estimation of geometrical dimensions of the power module package within the heat flow path. This method is applied for localization of failures during power cycling test.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
A. Hensler, D. Wingert, Ch. Herold, J. Lutz, M. Thoben,