Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
6947410 | Microelectronics Reliability | 2011 | 5 Pages |
Abstract
With this paper we propose a detailed study of the gradual degradation of InGaN-based laser diodes and Light-Emitting Diodes submitted to electro-thermal stress. The two device structures have been processed from the same epitaxial wafer. Our purpose is to compare the behavior of the two devices by means of electro-optical measurements, electroluminescence characterization, and near field emission measurements. We demonstrate that: (i) stress induces a decrease in the optical power and an increase in threshold current; (ii) the two failure modes are strictly linked each other, and correlated to the increase in defect-related current components, indicating a substantial increase in defect density during degradation; (iii) analysis of characteristic temperature and near-field emission measurements do not indicate any strong variation of injection efficiency nor current confinement of the devices.
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Authors
N. Trivellin, M. Meneghini, C. De Santi, S. Vaccari, G. Meneghesso, E. Zanoni, K. Orita, S. Takigawa, T. Tanaka, D. Ueda,