Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
6947452 | Microelectronics Reliability | 2011 | 5 Pages |
Abstract
⺠The power cycling test is conducted based on IEC standard. ⺠Coupled electro-thermal and thermal-mechanical finite element analysis are proposed. ⺠Validation of the test data and simulation results is within a reasonable range. ⺠Compressive stress occurs at the wire/chip interface. ⺠Major driving force contributing to the interface is the wire bump self-expansion.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
T.Y. Hung, S.Y. Chiang, C.J. Huang, C.C. Lee, K.N. Chiang,