Article ID Journal Published Year Pages File Type
6947452 Microelectronics Reliability 2011 5 Pages PDF
Abstract
► The power cycling test is conducted based on IEC standard. ► Coupled electro-thermal and thermal-mechanical finite element analysis are proposed. ► Validation of the test data and simulation results is within a reasonable range. ► Compressive stress occurs at the wire/chip interface. ► Major driving force contributing to the interface is the wire bump self-expansion.
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
Authors
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