| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6947465 | Microelectronics Reliability | 2011 | 4 Pages |
Abstract
⺠We perform experiments and analyses to examine the warpage of brazed Al/AlN. Al/AlN layered structures are subjected to high heat fluctuations. ⺠For the analysis, we use a non-linear kinematic hardening model considering cyclic hardening, viscoplasticity, and creep. ⺠The kinematic hardening model simulates the results of experiments well.
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Authors
T. Asada, Y. Yagi, M. Usui, T. Suzuki, N. Ohno,